3D-Printed Multi-Metal Antennas With Enhanced Bandwidth
3D-Printed Low-Profile Single-Substrate Multi-Metal Layer Antennas and Array With Bandwidth Enhancement by Li M., et al.
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Long Term And Cryogenic Endurance Of FPC Interconnection Approaches
This technical Article is created by following Authors: Alois Friedberger, Andreas Helwig Airbus CRT, Central R&T, Taufkirchen (Munich), Germany Patrick Hornung ...
The Mastery Of UPD Technology In Nanomaterial Dispensing For Advanced Manufacturing
XTPL Ultra Precise Dispensing (UPD) technology is a system, standing for precision and innovation, that seamlessly integrates into both existing and prospective production lines. The UPD system, ...
Horizon Invests In In-House Micro AM Machine From BMF & Now Offers Truly Vertically Integrated 3D Microfabrication Service
When producing exceptionally precise and tight tolerance parts and components, the significance and added value of a vertically integrated development and manufacturing partner becomes paramount.
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We combine proprietary, 3D-capable coating technologies for conductive and metallic materials with polymer micro-AM technologies and the general toolbox of 3D microstructuring technology. The ...
For more than 30 years, Fraunhofer IKTS has been demonstrating the potential of ceramic materials. We develop electronic components that are suitable for use in harsh environments with high thermal, ...
Hummink is the leading developer and supplier of High Precision Capillary Printing (HPCAP), a revolutionary technology for the display, semiconductor and printed electronics industry.
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J.A.M.E.S Coin NFC Side Mounted LED
This design is intended to bring two additional aspects to the NFC story. Side mount and integration of components are intended to spice up to the NFC story. The design contains two print jobs, the bottom one is for population and functionality and the top one serves as cover for a possible logo ...
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